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AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

lEquipping dual vibrationfeeding, andsupporting0606–2121 LEDbeads, Package and otherbulkcomponentmountingat any pitch.lFeaturing highquickchangeoverefficiencyand self-programming mixed-mountcapabilit...
On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

In theclip bonding packagingprocess of power devices, dispensing on the chip is crucial for ensuring tight bonding of the clip, which in turn guarantees a stable electrical connection between the clip...
Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

The world's first semiconductor chip-level printer with narrow-edge printing enables high precision 3D step printing. It can print on chips under high precision pressure control.It is applied in p...

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency
———— 2025-08-04Asmade (Shenzhen) Technology Limited
lEquipping dual vibrationfeeding, andsupporting0606–2121 LEDbeads, Package and otherbulkcomponentmountingat any pitch.lFeaturing highquickchangeoverefficiencyand self-programming mixed-mountcapabilit...
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On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging
———— 2025-07-29Asmade (Shenzhen) Technology Limited
In theclip bonding packagingprocess of power devices, dispensing on the chip is crucial for ensuring tight bonding of the clip, which in turn guarantees a stable electrical connection between the clip...
MORE +
Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
———— 2025-05-22Asmade (Shenzhen) Technology Limited
The world's first semiconductor chip-level printer with narrow-edge printing enables high precision 3D step printing. It can print on chips under high precision pressure control.It is applied in p...
MORE +
Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
———— 2025-04-24Asmade (Shenzhen) Technology Limited
The Epoxy Die Bonder is a semiconductor machine that features both the spot epoxy process and die bonding process. It can conduct spot epoxy processes and stamping processes using epoxy and other adhe...
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ASMADE cordially invites you to SEMICON CHINA 2025.
———— 2025-03-24Asmade (Shenzhen) Technology Limited
ASMADE cordially invites you to SEMICON CHINA 2025.From March 26th to 28th, 2025, ASMADE will showcase new semiconductor die bonding solutions in the fields of semiconductor packaging, optical module ...
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Competitiveness Analysis of MiniLED Backlight Packaging Enterprises in Chinese Mainland
———— 2023-05-12Asmade (Shenzhen) Technology Limited
In the past decade, the LED industry has focused on lighting, while in the next decade, the LED industry will focus on displays. Specifically, it should be new displays, mainly including Mini LED and Micro LED. The Micro LED market still has a long way to go b...
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Three Key Words to Look at the Current Situation of Mini LED Packaging End
———— 2023-05-12Asmade (Shenzhen) Technology Limited
At the packaging end, due to the production rhythm being constrained by upstream production capacity and directly affecting the output of downstream applications, the production capacity and technological progress at the packaging end are particularly concerne...
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How has the packaging form, luminescent materials, and driving IC changed from MiniLED to MicroLED?
———— 2023-05-12Asmade (Shenzhen) Technology Limited
From the perspective of packaging, I divide LED display screens into three eras: small spacing, Mini, and Micro. Different packaging eras have different product forms for LED display devices.
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Mini LED Packaging Solution Explanation - Printing Chapter
———— 2023-05-12Asmade (Shenzhen) Technology Limited
In recent years, with the rapid development of the panel industry and the crazy expansion of domestic manufacturers, the relationship between supply and demand of products has been basically eased, and manufacturers began to focus on the improvement of product...
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ISLE 2021 Exhibition is about to kick off, and Zhuoxing Technology invites you to learn innovative display technology together
———— 2023-05-12Asmade (Shenzhen) Technology Limited
In recent years, driven by technological innovation and related policy incentives, Mini LED has been advancing rapidly, and the market has gradually ushered in a bright growth period. Manufacturers throughout the entire industry chain have increased their layo...
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There are many difficulties in Mini-LED packaging, what are the best solutions to solve the printing process problems?
———— 2023-05-10Asmade (Shenzhen) Technology Limited
In recent years, with the rapid development of the panel industry and the crazy expansion of domestic manufacturers, the relationship between supply and demand of products has been basically eased, and manufacturers began to focus on the improvement of product...
MORE +
Packaging technology is more important than chip technology in Mini LED technology
———— 2023-05-10Asmade (Shenzhen) Technology Limited
Making Mini LED display panel products involves various comprehensive technologies such as LED chips, packaging, PCB board design and manufacturing, materials, equipment, testing, repair, production process
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Mini LED packaging equipment leading semiconductor business with unlimited potential for expansion
———— 2023-05-10Asmade (Shenzhen) Technology Limited
Mini LED direct display ushers in its explosive first year. In 2019, the size of China\'s Mini LED market was around 1.6 billion yuan, and it is expected to reach 3.78 billion yuan in 20 years, a year-on-year increase of 140%;
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Has the times changed? Why are old crystal solidification machines at a loss when facing Mini LEDs?
———— 2023-05-10Asmade (Shenzhen) Technology Limited
The traditional LED display market is booming, but as human demand for visual experience continues to increase and technology continues to update and develop
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When will China enter the era of "incremental" competition in semiconductor mergers and acquisitions?
———— 2023-05-10Asmade (Shenzhen) Technology Limited
After entering 2020, the global economic situation has been worrisome due to the impact of the epidemic. However, the semiconductor industry has become a major highlight in the sluggish economic environment due to its position at the top of the industrial chai...
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Mini crystal solidification machine industry dark horse? The yield of Asmade Semiconductor has reached 99.99%
———— 2023-05-10Asmade (Shenzhen) Technology Limited
In 2019, the Mini LED equipment track was selected and began to invest in research and development; in 2020, it successfully launched a flip-chip COB die-bonding machine, and has cooperated with many panel and LED display manufacturers. Asmade Semiconductor is...
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This year, almost all home appliance manufacturers will focus on "Mini LED" in their new product launches.
———— 2023-05-10Asmade (Shenzhen) Technology Limited
This year, almost all home appliance manufacturers will focus on \"Mini LED\" in their new product launches.
MORE +
Mini LED commercial launch in the first year, and Asmade Semiconductor flip chip COB solution may become an industry standard
———— 2023-05-10Asmade (Shenzhen) Technology Limited
In late April, the Mini LED industry ushered in heavy news: Apple released a new generation of iPad Pro on the 21st, and it was equipped with Mini LED backlight technology for the first time. One stone caused a thousand waves. This heavy news quickly ignited t...
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Asmade Semiconductor 3C Solid Crystal Rule: a new technological revolution that leverages the LED display industry
———— 2023-05-10Asmade (Shenzhen) Technology Limited
This year\'s National Two Sessions proposed to promote the deep integration of technological innovation and the real economy, better play the role of innovation-driven development
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Asmade Semiconductor Double Arm Single Board Solidification, Improving the Growth and Quality of the Display Panel Industry
———— 2023-05-10Asmade (Shenzhen) Technology Limited
With the development of technology and the improvement of living standards, people have higher requirements for displays, and ultra high definition 4K and 8K large-sized display applications have become a more favored choice for people.
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New Information

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

lEquipping dual vibrationfeeding, andsupporting0606–2121 LE...
On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

In theclip bonding packagingprocess of power devices, dispen...
Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

The world's first semiconductor chip-level printer with ...
Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.

The Epoxy Die Bonder is a semiconductor machine that feature...

0755-29691921

Hotline：0755-29691921

Phone：0755-29691921

Fax：0755-29691921

Email：market@asmade.cn

Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province

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Hotline:0755-29691921

News

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.

ASMADE cordially invites you to SEMICON CHINA 2025.

Competitiveness Analysis of MiniLED Backlight Packaging Enterprises in Chinese Mainland

Three Key Words to Look at the Current Situation of Mini LED Packaging End

How has the packaging form, luminescent materials, and driving IC changed from MiniLED to MicroLED?

Mini LED Packaging Solution Explanation - Printing Chapter

ISLE 2021 Exhibition is about to kick off, and Zhuoxing Technology invites you to learn innovative display technology together

There are many difficulties in Mini-LED packaging, what are the best solutions to solve the printing process problems?

Packaging technology is more important than chip technology in Mini LED technology

Mini LED packaging equipment leading semiconductor business with unlimited potential for expansion

Has the times changed? Why are old crystal solidification machines at a loss when facing Mini LEDs?

When will China enter the era of "incremental" competition in semiconductor mergers and acquisitions?

Mini crystal solidification machine industry dark horse? The yield of Asmade Semiconductor has reached 99.99%

This year, almost all home appliance manufacturers will focus on "Mini LED" in their new product launches.

Mini LED commercial launch in the first year, and Asmade Semiconductor flip chip COB solution may become an industry standard

Asmade Semiconductor 3C Solid Crystal Rule: a new technological revolution that leverages the LED display industry

Asmade Semiconductor Double Arm Single Board Solidification, Improving the Growth and Quality of the Display Panel Industry

New Information

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.

0755-29691921

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