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Automatic Clip Bonding Solution AS2001
———— 2024-10-14Asmade (Shenzhen) Technology LimitedFeatures:1. Adopt stencil printing to improve printing efficiency and precision2. Use a turret bonder with adjustable bonding angles and pressures3. Optional secondary printing on silicon wafers to ac...
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AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency
lEquipping dual vibrationfeeding, andsupporting0606–2121 LE...
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On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging
In theclip bonding packagingprocess of power devices, dispen...
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Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
The world's first semiconductor chip-level printer with ...
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Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
The Epoxy Die Bonder is a semiconductor machine that feature...
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0755-29691921