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ASMADE cordially invites you to SEMICON CHINA 2025.
———— 2025-03-24Asmade (Shenzhen) Technology LimitedASMADE cordially invites you to SEMICON CHINA 2025.From March 26th to 28th, 2025, ASMADE will showcase new semiconductor die bonding solutions in the fields of semiconductor packaging, optical module ...
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Mini crystal solidification machine industry dark horse? The yield of Asmade Semiconductor has reached 99.99%
———— 2023-05-10Asmade (Shenzhen) Technology LimitedIn 2019, the Mini LED equipment track was selected and began to invest in research and development; in 2020, it successfully launched a flip-chip COB die-bonding machine, and has cooperated with many panel and LED display manufacturers. Asmade Semiconductor is...
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This year, almost all home appliance manufacturers will focus on "Mini LED" in their new product launches.
———— 2023-05-10Asmade (Shenzhen) Technology LimitedThis year, almost all home appliance manufacturers will focus on \"Mini LED\" in their new product launches.
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Mini LED commercial launch in the first year, and Asmade Semiconductor flip chip COB solution may become an industry standard
———— 2023-05-10Asmade (Shenzhen) Technology LimitedIn late April, the Mini LED industry ushered in heavy news: Apple released a new generation of iPad Pro on the 21st, and it was equipped with Mini LED backlight technology for the first time. One stone caused a thousand waves. This heavy news quickly ignited t...
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Asmade Semiconductor 3C Solid Crystal Rule: a new technological revolution that leverages the LED display industry
———— 2023-05-10Asmade (Shenzhen) Technology LimitedThis year\'s National Two Sessions proposed to promote the deep integration of technological innovation and the real economy, better play the role of innovation-driven development
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Asmade Semiconductor Double Arm Single Board Solidification, Improving the Growth and Quality of the Display Panel Industry
———— 2023-05-10Asmade (Shenzhen) Technology LimitedWith the development of technology and the improvement of living standards, people have higher requirements for displays, and ultra high definition 4K and 8K large-sized display applications have become a more favored choice for people.
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New Information
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Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
The world's first semiconductor chip-level printer with ...
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Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
The Epoxy Die Bonder is a semiconductor machine that feature...
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ASMADE cordially invites you to SEMICON CHINA 2025.
ASMADE cordially invites you to SEMICON CHINA 2025.From Marc...
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Competitiveness Analysis of MiniLED Backlight Packaging Enterprises in Chinese Mainland
In the past decade, the LED industry has focused on lighting...
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