-
Competitiveness Analysis of MiniLED Backlight Packaging Enterprises in Chinese Mainland
———— 2023-05-12Asmade (Shenzhen) Technology LimitedIn the past decade, the LED industry has focused on lighting, while in the next decade, the LED industry will focus on displays. Specifically, it should be new displays, mainly including Mini LED and Micro LED. The Micro LED market still has a long way to go b...
MORE + -
Three Key Words to Look at the Current Situation of Mini LED Packaging End
———— 2023-05-12Asmade (Shenzhen) Technology LimitedAt the packaging end, due to the production rhythm being constrained by upstream production capacity and directly affecting the output of downstream applications, the production capacity and technological progress at the packaging end are particularly concerne...
MORE + -
How has the packaging form, luminescent materials, and driving IC changed from MiniLED to MicroLED?
———— 2023-05-12Asmade (Shenzhen) Technology LimitedFrom the perspective of packaging, I divide LED display screens into three eras: small spacing, Mini, and Micro. Different packaging eras have different product forms for LED display devices.
MORE + -
Mini LED Packaging Solution Explanation - Printing Chapter
———— 2023-05-12Asmade (Shenzhen) Technology LimitedIn recent years, with the rapid development of the panel industry and the crazy expansion of domestic manufacturers, the relationship between supply and demand of products has been basically eased, and manufacturers began to focus on the improvement of product...
MORE + -
ISLE 2021 Exhibition is about to kick off, and Zhuoxing Technology invites you to learn innovative display technology together
———— 2023-05-12Asmade (Shenzhen) Technology LimitedIn recent years, driven by technological innovation and related policy incentives, Mini LED has been advancing rapidly, and the market has gradually ushered in a bright growth period. Manufacturers throughout the entire industry chain have increased their layo...
MORE +
New Information
-
AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency
lEquipping dual vibrationfeeding, andsupporting0606–2121 LE...
-
On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging
In theclip bonding packagingprocess of power devices, dispen...
-
Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
The world's first semiconductor chip-level printer with ...
-
Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
The Epoxy Die Bonder is a semiconductor machine that feature...
0755-29691921
Hotline：0755-29691921
Phone：0755-29691921
Fax：0755-29691921
Email：market@asmade.cn
Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
0755-29691921