Features:

1. Adoption of planar turret die bonding to enhance die bonding efficiency.

2. Multi-station die bonding with chip damage detection.

3. Real-time correction of bond head angle with an accuracy up to 0.2 degrees.

4. Controllable die bonding pressure.

5. Adopting marble machine workplace for higher stability.

6. Adopt linear motor module for higher durability.

7. Incorporation of vacuum crystal leakage detection and nozzle cleaning design.

8. Vacuum die bonding platform and surface flatness correction design.

9. Serial connection, automatic left-in and right-out die loading and unloading, fully automated manufacture.

10. Self-developed software operation and control platform for intelligent equipment operation.